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LX1692IPW Datasheet(PDF) 2 Page - Microsemi Corporation

Part # LX1692IPW
Description  TM Full Bridge Resonant CCFL Controller
Download  15 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

LX1692IPW Datasheet(HTML) 2 Page - Microsemi Corporation

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LX1692
PRODUCTION DATA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
© 2004
Rev. 1.2, 12/20/2006
Full Bridge Resonant CCFL Controller
TM
®
ABSOLU T E MAX I M U M RATINGS
Supply Input Voltage(VDDP)............................................................................................. 6.6V
VIN_SNS
.........................................................-0.3V to (VDDP+0.5V), not to exceed +6.6V
Digital Input (ENABLE) ................................... -0.3V to (VDDP+0.5V) , not to exceed +6.6V
Analog Inputs (ISNS, OV_SNS, OC_SNS)clamped to ±14V Max Peak Current ±100mA
Analog Inputs (BRITE_A, BRITE_D) ............. -0.3V to (VDDP +0.5V) , not to exceed +6.6V
Digital Outputs (AOUT, BOUT, COUT, DOUT) -0.3V to (VDDP +0.5V) , not to exceed +6.6V
Analog Outputs (I_R, ICOMP, VCOMP)........ -0.3V to (VDDP + 0.5V) , not to exceed +6.6V
Maximum Operating Junction Temperature .....................................................................150°C
Storage Temperature Range....................................................................................-65 to 150°C
Peak Package Solder Reflow Temp.(40 seconds max. exposure) .........................260°C(+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect
to
Ground. Currents are positive into, negative out of specified terminal
.
THER MAL DATA
DW Plastic SOIC 20-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
85
°C/W
PW Plastic TSSOP 20-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
99
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The
θ
JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
PACKAG E PIN OU T
C_R
I_R
C_BST
C_TO
VDDA
ENABLE
BRITE_D
ICOMP
VIN_SNS
OC_SNS
OV_SNS
ISNS
DOUT
COUT
BOUT
AOUT
1
10
11
20
VCOMP
BRITE_A
GND
VDDP
PW PACKAGE
(Top View)
1
10
11
20
9
8
7
6
5
4
3
2
12
13
14
15
16
17
18
19
C_R
I_R
C_BST
C_TO
VDDA
ENABLE
BRITE_D
ICOMP
VCOMP
BRITE_A
VIN_SNS
OC_SNS
OV_SNS
ISNS
DOUT
COUT
BOUT
AOUT
GND
VDDP
DW PACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
FUNCTIO N AL PIN DESCRIPTION
Name
Description
C_R
Lamp Frequency Programming Capacitor Pin – lamp running frequency is set by the combination of C_R and
I_R. The internal lamp current oscillator frequency can be forced to follow an external clock signal at this pin. In
this case, the programmed frequency must be lower than the external frequency. Minimum pulse width for
external synch signal is 1µsec. Maximum duty is 50%
I_R
Current Reference Resistor Input. Connects to an external resistor that determines the magnitude of internal
bias currents. The I_R pin is a DC reference voltage of 1V. This voltage cannot be used for other than its
intended function. The reference current established at this pin by connecting an external resistor is used to
charge a capacitor at the C_R pin. The nominal lamp frequency can be adjusted by varying this resistor value in
the range of 20K to 100K Ohms. (Note: C is in pF, R is in
Ω
K
, Freq is in KHz).
R
_
I
R
_
C
3
LAMP
R
C
10
242
F
×
=
Other reference currents derived from I_R are used for the digital dimming burst oscillator and the strike time
out function.


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