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SG137AL Datasheet(PDF) 2 Page - Microsemi Corporation

Part # SG137AL
Description  1.5 AMP NEGATIVE ADJUSTABLE REGULATOR
Download  6 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

SG137AL Datasheet(HTML) 2 Page - Microsemi Corporation

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SG137A/SG137 SERIES
2/92 Rev 1.1 2/94
LINFINITY Microelectronics Inc.
Copyright
© 1994
11861 Western Avenue
∞ Garden Grove, CA 92841
2
(714) 898-8121
∞ FAX: (714) 893-2570
Power Dissipation ..........................................
Input to Output Voltage Differential ....................................
Storage Temperature Range ............................
ABSOLUTE MAXIMUM RATINGS (Note 1)
Internally Limited
40V
-65
°C to 150°C
Operating Junction Temperature
Hermetic (K, R, T, L, IG-Packages) ...........................
Lead Temperature (Soldering, 10 Seconds) .............
150
°C
300
°C
Note 1. Exceeding these ratings could cause damage to the device.
RECOMMENDED OPERATING CONDITIONS (Note 2 & 3)
Input Voltage Range ..............................-(V
OUT + 3.5V) to -36V
Operating Junction Temperature Range
SG137A/SG137 ............................................
SG237A/SG237 ............................................
SG337A/SG337 .............................................
-55°C to 150°C
-25°C to 150°C
0°C to 125°C
Note 2. Range over which the device is functional.
Note 3. These ratings are applicable for junction temperatures of less than 135°C.
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over full operating ambient temperatures for SG137A/SG137 with -55°C
≤ T
A
150°C, SG237A/
SG237 with -25°C
≤ T
A
150°C, SG337A/SG337 with 0°C
≤ T
A
125°C, |V
IN
- V
OUT
| = 5.0V, and for I
OUT
= 500mA (K, R, and IG power packages) and I
OUT
= 100mA (T and L packages). Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2
Ωfor the T and
L packages, and 20
Ω for the K, R, and IG packages. I
MAX is 1.5A for the K, R, and IG packages and 0.5A for the T and L packages. Low duty cycle pulse
testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.)
THERMAL DATA
K Package:
Thermal Resistance-Junction to Leads,
θ
JC ................
3.0°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............... 35°C/W
R Package:
Thermal Resistance-Junction to Leads,
θ
JC ................
5.0°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ..............
40°C/W
T Package:
Thermal Resistance-Junction to Leads,
θ
JC .................
15°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............
120°C/W
IG Package:
Thermal Resistance-Junction to Leads,
θ
JC ................
3.5°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ..............
42°C/W
L Package:
Thermal Resistance-Junction to Leads,
θ
JC .................
35°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............
120°C/W
Units
SG137/SG237
Min.
Typ. Max.
Min.
Typ. Max.
SG137A/SG237A
Parameter
Test Conditions
I
OUT = 10mA,
T
A = 25°C
3V
≤ |V
IN - VOUT| ≤ 40V, 10mA ≤ IOUT ≤ IMAX
3V
≤ |V
IN - VOUT| ≤
40V, I
OUT ≤ IMAX
T
A = 25°C
10mA
≤ I
OUT ≤ IMAX
|V
OUT| ≤ 5V, TA = 25°C
|V
OUT| ≥
5V, T
A = 25°C
|V
OUT| ≤ 5V
|V
OUT| ≥
5V
T
A = 25°C, 10ms pulse
V
OUT = -10V, f =120Hz
C
ADJ = 0, TA = 25°C
C
ADJ = 10µF
T
A = 25°C
3V
≤ |V
IN - V OUT| ≤ 40V
10mA
≤ I
OUT ≤ IMAX
Reference Voltage (Note 6)
Line Regulation (Note 4, 6)
Load Regulation (Note 4)
Thermal Regulation (Note 5)
Ripple Rejection
Adjust Pin Current
Adjust Pin Current Change
(Note 6)
-1.238
-1.220
60
70
-1.250
-1.250
0.005
5
0.1
10
0.2
0.002
66
80
65
1.0
0.2
-1.262
-1.280
0.01
25
0.5
50
1.0
0.02
100
5
2
-1.225
-1.200
66
-1.250
-1.250
0.01
15
0.3
20
0.3
0.002
60
77
65
2
0.5
-1.275
-1.300
0.02
25
0.5
50
1.0
0.02
100
5
5
V
V
%/V
mV
%
mV
%
%/W
dB
dB
µA
µA
µA
Note A. Junction Temperature Calculation: T
J = TA + (PD x θJA).
Note B. The above numbers for
θ
JC are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
JA numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.


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