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GDSGA0-B00E Datasheet(PDF) 1 Page - Rectron Semiconductor

Part # GDSGA0-B00E
Description  STANDARD GPP CHIP - 100MIL
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Manufacturer  RECTRON [Rectron Semiconductor]
Direct Link  http://www.rectron.com
Logo RECTRON - Rectron Semiconductor

GDSGA0-B00E Datasheet(HTML) 1 Page - Rectron Semiconductor

  GDSGA0-B00E Datasheet HTML 1Page - Rectron Semiconductor GDSGA0-B00E Datasheet HTML 2Page - Rectron Semiconductor  
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GDSGA0-500E
GDSGA0-700E
GDSGA0-900E
GDSGA0-B00E
STANDARD GPP CHIP - 100MIL
CHIPS FOR STD GPP/SOLDERING TYPE
TYPE: GDSGA0 SERIES
CHIP APPEARANCE
FEATURES
* Silicon chip with Boron / Phosphorus dopants
Maximum Instantaneous Forward Voltage at 3A DC
Maximum Average Reverse Current
at Rated DC Blocing Voltage
Storage Temperature Range
Operating Temperature Range
Maximum Recurrent Peak Reverse Voltage
Maximum Average Forward Rectified Current
at Derating Case Temperature
* Solderable metallization Ni / Au
* Glass passivated junction
CHIP DIMENSIONS
GDSGA0-B00E
GDSGA0-500E
CHIP SIZE
Contact area
Total CHIP THICKNESS
SOLDERABLE
METALLIZATION
100 x 100 mils
75 x 75 mils
11 mils
Ni / Au
GDSGA0-700E GDSGA0-900E
GDSGA0-B00E
GDSGA0-500E
GDSGA0-700E
GDSGA0-900E
PRODUCT SPECIFICATIONS
RATINGS
SYMBOL
TSTG
UNITS
0
C
TJ
0
C
IO
VR
400
@ TA=25OC
@ TA=100OC
1.1
3
5
300
150
-55 to + 150
600
800
1000
Amps
uAmps
Volts
Volts
IR
VF
RECTRON
TECHNICAL SPECIFICATION
SEMICONDUCTOR
11mil
10.2mil
100mil
75mil


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