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MAX9830AETA+ Datasheet(PDF) 8 Page - Maxim Integrated Products |
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MAX9830AETA+ Datasheet(HTML) 8 Page - Maxim Integrated Products |
8 / 12 page Applications Information Filterless Class D Operation Traditional Class D amplifiers require an output filter. The filter adds cost, size, and decreases efficiency and THD+N performance. The MAX9830’s filterless modula- tion scheme does not require an output filter. Because the switching frequency of the MAX9830 is well beyond the bandwidth of most speakers, voice coil movement at the switching frequency is very small. Use a speaker with a series inductance > 10µH. Typical 8 Ω speakers exhibit series inductances in the 20µH to 100µH range. Component Selection Optional Ferrite Bead Filter Although not normally needed, in applications where speaker leads exceed 24in at VPVDD = 3V, use a filter constructed from an inexpensive ferrite bead and a small-value capacitor to ground (Figure 2) to provide additional EMI suppression. Use a ferrite bead with low DC resistance, high frequency ( ≥ 1MHz) impedance of 100 Ω to 600Ω, and rated for at least 1A. The capacitor value varies based on the ferrite bead chosen and the actual speaker lead length. Select the capacitor value based on EMI performance. Speaker Amplifier Power Supply Input (PVDD) PVDD powers the speaker amplifier. PVDD ranges from 2.6V to 5.5V. Bypass PVDD with a 0.1µF capacitor to PGND. Apply additional bulk capacitance at the device if long input traces between PVDD and the power source are used. Ensure a rate of voltage rise at PVDD is limited to 1V/µs. Input Filtering The input-coupling capacitor (CIN), in conjunction with the amplifier’s internal input resistance (RIN), forms a highpass filter that removes the DC bias from the incoming signal. These capacitors allow the amplifier to bias the signal to an optimum DC level. Select 0.47µF capacitors for optimum click-and-pop performance and 17Hz f-3dB. If a different f-3dB is required, CIN, assuming zero- source-impedance, is: Use capacitors with adequately low voltage-coefficient for best low-frequency THD performance. Layout and Grounding Proper layout and grounding are essential for optimum performance. Good grounding improves audio perfor- mance and prevents switching noise from coupling into the audio signal. Use wide, low-resistance output traces. As load imped- ance decreases, the current drawn from the device out- puts increase. At higher current, the resistance of the output traces decrease the power delivered to the load. For example, if 2W is delivered from the speaker output to a 4 Ω load through a 100mΩ trace, 49mW is con- sumed in the trace. If power is delivered through a 10m Ω trace, only 5mW is consumed in the trace. Wide output, supply and ground traces also improve the power dissipation of the device. The MAX9830 is inherently designed for excellent RF immunity. For best performance, add ground fills around all signal traces on top and bottom PCB planes. The MAX9830 TDFN package features an exposed thermal pad on its underside. This pad lowers the pack- age’s thermal resistance by providing a heat conduc- tion path from the die to the PCB. Connect the exposed thermal pad to the ground plane by using a large pad and multiple vias. Chip Information PROCESS: CMOS C f µF IN dB = 8 3 [] - Mono 2W Class D Amplifier 8 _______________________________________________________________________________________ MAX9830 OUT+ OUT- Figure 2. Optional Ferrite Bead Filter |
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