8

RY SERIES

1. General Information

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Relaysproducedafterthespecificdatecodethatisindicatedoneachdatasheetarelead-free

now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.

(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)

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Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu.

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All signal and most power relays also comply with RoHS. Please refer to individual data

sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that

are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).

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Ithasbeenverifiedthatusinglead-freerelaysinleadedassemblyprocesswillnotcauseany

problems (compatible).

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“LF”ismarkedoneachouterandinnercarton.(Nomarkingonindividualrelays).

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Toavoidleadedrelays(forlead-freesample,etc.)pleaseconsultwithareasalesoffice.

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Wewillshipleadedrelaysaslongastheleadedrelayinventoryexists.

Note:CadmiumwasexemptedfromRoHSonOctober21,2005.(AmendmenttoDirective2002/95/EC)

2. Recommended Lead Free Solder Profile

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Recommended solder paste Sn-3.0Ag-0.5Cu.

RoHS Compliance and Lead Free Relay Information

Reflow Solder condition

3. Moisture Sensitivity

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Moisture Sensitivity Level standard is not applicable to electromechanical realys.

4. Tin Whisker

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Dipped SnAgCu solder is known as low risk tin whisker. No considerable length whisker was found by our in

house test.

We highly recommend that you confirm your actual solder conditions

Flow Solder condition:

Pre-heating:

maximum120˚C

Soldering:

dip within 5 sec. at

260˚Csolerbath

Solder by Soldering Iron:

Soldering Iron

Temperature: maximum360˚C

Duration:

maximum3sec.