74AUP1G34_3

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 — 14 August 2008

10 of 15

NXP Semiconductors

74AUP1G34

Low-power buffer

13. Package outline

Fig 9.

Package outline SOT353-1 (TSSOP5)

UNIT

A1

A

max.

A2

A3

bp

L

HE

Lp

wy

v

ce

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.1

0

1.0

0.8

0.30

0.15

0.25

0.08

2.25

1.85

1.35

1.15

0.65

e1

1.3

2.25

2.0

0.60

0.15

7

°

0

°

0.1

0.1

0.3

0.425

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

0.46

0.21

SOT353-1

MO-203

SC-88A

00-09-01

03-02-19

bp

D

Z

e

e1

0.15

13

5

4

θ

A

A2

A1

Lp

(A3)

detail X

L

HE

E

c

X

A

y

1.5

3 mm

0

scale

TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm

SOT353-1

1.1