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HAL208JQ-K Datasheet(PDF) 11 Page - Micronas |
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HAL208JQ-K Datasheet(HTML) 11 Page - Micronas |
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11 / 17 page  DATA SHEET HAL 2xy Micronas Jan. 11, 2010; DSH000141_003EN 11 Fig. 3–3: Recommended footprint SOT89B-3, Dimensions in mm All dimensions are for reference only. The pad size may vary depending on the requirements of the soldering process. SOT89B Package Rthja Rthjc Thermal Resistance Junction to Ambient Junction to Case − − − − − − 212 73 K/W K/W Measured with a 1s0p board 30 mm x 10 mm x 1.5 mm, pad size (see Fig. 3–3) TO92UA Package Rthja Rthjc Thermal Resistance Junction to Ambient Junction to Case − − − − − − 225 63 K/W K/W Measured with a 1s0p board 1) V DD = 12 V, B > BON + 2 mT or B < BOFF − 2 mT and B > BOFF + 2 mT or B < BON - 2 mT for HAL 212 Symbol Parameter Pin No. Min. Typ. Max. Unit Conditions 1.05 1.05 1.80 0.50 1.50 1.45 2.90 |
Similar Part No. - HAL208JQ-K |
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Similar Description - HAL208JQ-K |
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