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HAL526UA-E Datasheet(PDF) 5 Page - Micronas |
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HAL526UA-E Datasheet(HTML) 5 Page - Micronas |
5 / 24 page DATA SHEET HAL 525, HAL 526 Micronas Nov. 30, 2009; DSH000144_003EN 5 1.5. Hall Sensor Package Codes Hall sensors are available in a wide variety of packag- ing versions and quantities. For more detailed informa- tion, please refer to the brochure: “Hall Sensors: Ordering Codes, Packaging, Handling”. 1.6. Solderability and Welding During soldering reflow processing and manual reworking, a component body temperature of 260 C should not be exceeded. Welding Device terminals should be compatible with laser and resistance welding. Please note that the success of the welding process is subject to different welding parameters which will vary according to the welding technique used. A very close control of the welding parameters is absolutely necessary in order to reach satisfying results. Micronas, therefore, does not give any implied or express warranty as to the ability to weld the component. 1.7. Pin Connections Fig. 1–1: Pin configuration HALXXXPA-T Example: HAL526UA-E → Type: 526 → Package: TO92UA → Temperature Range: T J = −40 °C to +100 °C Temperature Range: K or E Package: SF for SOT89B-1 UA for TO92UA Type: 526 1 VDD 2GND 3 OUT |
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