HAL502UA-A datasheet(6/48 Pages) MICRONAS

6 / 48 page

HAL 5xy

DATA SHEET

6

Jan. 11. 2010; DSH000020_004EN

Micronas

1.6. Solderability and Welding

Soldering

During

soldering

reflow

processing

and

manual

reworking, a component body temperature of 260

°C

should not be exceeded.

Welding

Device terminals should be compatible with laser and

resistance welding. Please note that the success of

the welding process is subject to different welding

parameters which will vary according to the welding

technique used. A very close control of the welding

parameters is absolutely necessary in order to reach

satisfying results. Micronas, therefore, does not give

any implied or express warranty as to the ability to

weld the component.

Fig. 1–1: Pin configuration

1 VDD

2, 4

GND

3

OUT

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