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TJA1054AT Datasheet(PDF) 10 Page - NXP Semiconductors

Part # TJA1054AT
Description  Fault-tolerant CAN transceiver
Download  27 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

TJA1054AT Datasheet(HTML) 10 Page - NXP Semiconductors

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TJA1054A_5
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 05 — 29 September 2009
10 of 27
NXP Semiconductors
TJA1054A
Fault-tolerant CAN transceiver
[1]
All voltages are defined with respect to pin GND, unless otherwise specified. Positive current flows into the
device.
[2]
Only relevant if VWAKE <VGND − 0.3 V; current will flow into pin GND.
[3]
Junction temperature in accordance with
“IEC 60747-1”. An alternative definition is: Tvj =Tamb +P × Rth(vj-a)
where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable
combinations of power dissipation (P) and ambient temperature (Tamb).
[4]
Equivalent to discharging a 100 pF capacitor through a 1.5 k
Ω resistor.
[5]
Equivalent to discharging a 200 pF capacitor through a 10
Ω resistor and a 0.75 µH coil.
9.
Thermal characteristics
VI(WAKE)
input voltage on pin WAKE
with respect to any
other pin
-VBAT + 0.3 V
II(WAKE)
input current on pin WAKE
[2]
−15
-
mA
VINH
voltage on pin INH
−0.3
VBAT + 0.3 V
VRTH
voltage on pin RTH
with respect to any
other pin
−0.3
VBAT + 1.2 V
VRTL
voltage on pin RTL
with respect to any
other pin
−0.3
VBAT + 1.2 V
RRTH
termination resistance on
pin RTH
500
16000
RRTL
termination resistance on
pin RTL
500
16000
Tvj
virtual junction temperature
[3]
−40
+150
°C
Tstg
storage temperature
−55
+150
°C
VESD
electrostatic discharge
voltage
human body model
[4]
pins RTH, RTL,
CANH and CANL
−4+4
kV
all other pins
−2+2
kV
machine model
[5]
any pin
−150
+150
V
Table 6.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction
to ambient
in free air
120
K/W
Rth(j-s)
thermal resistance from junction
to substrate bare die
in free air
40
K/W


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