UBA2024_4

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 04 — 17 September 2009

11 of 14

NXP Semiconductors

UBA2024

Half-bridge power IC for CFL lamps

Fig 8.

Package outline SOT108-1 (SO14)

UNIT

A

max.

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.0

0.4

SOT108-1

X

θ

A

D

Q

detail X

E

Z

e

c

L

(A )

3

A

7

8

1

14

y

076E06

MS-012

pin 1 index

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.35

0.34

0.16

0.15

0.05

1.05

0.041

0.244

0.228

0.028

0.024

0.028

0.012

0.01

0.25

0.01

0.004

0.039

0.016

99-12-27

03-02-19

0

2.5

5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1