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BLA6H1011-600 Datasheet(PDF) 8 Page - NXP Semiconductors |
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BLA6H1011-600 Datasheet(HTML) 8 Page - NXP Semiconductors |
8 / 13 page BLA6H1011-600_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 22 April 2010 8 of 13 NXP Semiconductors BLA6H1011-600 LDMOS avionics power transistor Printed-Circuit Board (PCB): Duroid 6006; ε r = 6.15 F/m; thickness = 0.64 mm; thickness copper plating = 35 μm. See Table 9 for a list of components. Fig 12. Component layout for class-AB production test circuit 001aal842 C3 C4 C1 R1 R2 C5 C6 C7 C10 C9 C8 R3 C11 C2 |
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