ABSOLUTE MAXIMUM RATINGS

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RECOMMENDED OPERATING CONDITIONS

PACKAGE SPECIFICATIONS

PTN78060W, PTN78060H

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

over operating free-air temperature range unless otherwise noted

all voltages with respect to GND

UNIT

Operating free-air temperature

–40°C to 85°C

Surface temperature of module body or

260°C

Wave solder temperature

Horizontal TH (suffix AH)

pins (5 seconds)

Surface temperature of module body or

Horizontal SMD (suffix AS)

235°C

Solder reflow temperature

pins

Horizontal SMD (suffix AZ)

260°C

Storage temperature

–55°C to 125°C

Input surge voltage, 10 ms maximum

38 V

Inhibit (pin 3) input voltage

–0.3 V to 5 V

Output power

45 W

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Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

MIN

MAX

UNIT

PTN78060W

7

36

Input voltage

V

PTN78060H

15

36

Operating free-air temperature

–40

85

°C

PTN78060x (Suffix AH, AS, and AZ)

Weight

3.9 grams

Flammability

Meets UL 94 V-O

Per Mil-STD-883D, Method 2002.3, 1 ms, 1/2 sine,

Mechanical shock

mounted

Horizontal T/H (suffix AH)

Mechanical vibration

Mil-STD-883D, Method 2007.2, 20-2000 Hz

Horizontal SMD (suffix AS and AZ)

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Qualification limit.

2

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