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BUK9Y09-40B Datasheet(PDF) 10 Page - NXP Semiconductors |
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BUK9Y09-40B Datasheet(HTML) 10 Page - NXP Semiconductors |
10 / 14 page BUK9Y09-40B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 7 April 2010 10 of 14 NXP Semiconductors BUK9Y09-40B N-channel TrenchMOS logic level FET 7. Package outline Fig 17. Package outline SOT669 (LFPAK) REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT669 MO-235 04-10-13 06-03-16 0 2.5 5 mm scale e E1 b c2 A2 A2 bc A e UNIT DIMENSIONS (mm are the original dimensions) mm 1.10 0.95 A3 A1 0.15 0.00 1.20 1.01 0.50 0.35 b2 4.41 3.62 b3 2.2 2.0 b4 0.9 0.7 0.25 0.19 c2 0.30 0.24 4.10 3.80 6.2 5.8 H 1.3 0.8 L2 0.85 0.40 L 1.3 0.8 L1 8 ° 0 ° wy D(1) 5.0 4.8 E(1) 3.3 3.1 E1 (1) D1 (1) max 0.25 4.20 1.27 0.25 0.1 1 23 4 mounting base D1 c Plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669 E b2 b3 b4 H D L2 L1 A A w M C C X 1/2 e yC θ θ (A ) 3 L A A1 detail X Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. |
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