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BUK765R2-40B Datasheet(PDF) 5 Page - NXP Semiconductors |
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BUK765R2-40B Datasheet(HTML) 5 Page - NXP Semiconductors |
5 / 13 page BUK765R2-40B_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 16 January 2009 5 of 13 NXP Semiconductors BUK765R2-40B N-channel TrenchMOS standard level FET 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - - 0.74 K/W Rth(j-a) thermal resistance from junction to ambient minimum footprint; mounted on a printed-circuit board -50 - K/W Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration 03nj25 single shot 0.2 0.1 0.05 0.02 10-3 10-2 10-1 1 10-6 10-5 10-4 10-3 10-2 10-1 1 tp (s) Zth(j-mb) (K/W) δ = 0.5 tp tp T P t T δ = |
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