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IT3D-300S-BGA Datasheet(PDF) 11 Page - Hirose Electric |
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IT3D-300S-BGA Datasheet(HTML) 11 Page - Hirose Electric |
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11 / 21 page  IT3 Thermal Cycling Test TR0636E-10026 - 11 - * 16 Layers in Total Fig. 1 PCB Layer Structure Fig. 2 BGA Land Design Layer Footprint type Top Daisy chain 2nd Ground layer 3rd Signal layer Type A 4th Ground layer 5th Signal layer Type B 6th Ground layer 7th Signal layer Type A 8th Ground layer 9th Signal layer Type B 10th Ground layer 11th Signal layer Type A 12th Ground layer 13th Signal layer Type B 14th Ground layer 15th Signal layer Type A Bottom Via test points Top layer (daisy chained) Ground (meshed. 70% copper) Signal (weaved 30% copper) Bottom layer (Probing pads for failure analysis and jumper cable) IT3* – 300S-BGA Foot Pattern 270-φ0.65+/- 0.05 (Solder Mask) |
Similar Part No. - IT3D-300S-BGA |
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Similar Description - IT3D-300S-BGA |
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