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MCIMX251AJM4 Datasheet(PDF) 1 Page - Freescale Semiconductor, Inc |
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MCIMX251AJM4 Datasheet(HTML) 1 Page - Freescale Semiconductor, Inc |
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1 / 132 page  Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX25AEC Rev. 5, 09/2010 MCIMX25 Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information. © Freescale Semiconductor, Inc., 2010. All rights reserved. 1 Introduction The i.MX25 family of processors offers integration that tailors itself to the connectivity requirements of today's automobile infotainment systems. These processors have been architected to meet auto infotainment requirements like CAN, USB connectivity, and audio connectivity, without many of the extra features only needed for high-end applications. As a result, the i.MX25 enables many of the features only available in high-end systems, but at a price point suitable for all vehicles. At the core of the i.MX25 is Freescale's fast, proven, power-efficient implementation of the ARM926EJ-S core, with speeds of up to 400 MHz. The i.MX25 includes support for up to 133-MHz DDR2 memory, integrated 10/100 Ethernet MAC, and two on-chip USB PHYs. The automotive versions of the i.MX25 offer AEC-Q100 grade 3 i.MX25 Applications Processor for Automotive Products Silicon Version 1.2 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9 3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11 3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11 3.2. Supply Power-Up/Power-Down Requirements and Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18 3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 19 3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20 3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 25 3.7. Module Timing and Electrical Parameters . . . . . . 42 4. Package Information and Contact Assignment . . . . . . 124 4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124 4.2. Ground, Power, Sense, and Reference Contact Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125 4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 130 5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 |
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