PBRP113ET_1

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 01 — 17 December 2007

9 of 12

NXP Semiconductors

PBRP113ET

PNP 800 mA, 40 V BISS RET; R1 = 1 k

Ω, R2 = 1 kΩ

9.

Packing information

[1]

For further information and the availability of packing methods, see Section 13.

10. Soldering

Table 8.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package

Description

Packing quantity

3000

10000

PBRP113ET

SOT23

4 mm pitch, 8 mm tape and reel

-215

-235

Fig 12. Reflow soldering footprint SOT23 (TO-236AB)

Fig 13. Wave soldering footprint SOT23 (TO-236AB)

solder resist

occupied area

solder lands

solder paste

Dimensions in mm

sot023

1.00

0.60

(3x)

1.30

1

2

3

2.50

3.00

0.85

2.70

2.90

0.50 (3x)

0.60 (3x)

3.30

0.85

sot023

4.00

4.60

2.80

4.50

1.20

3.40

3

21

1.20 (2x)

preferred transport direction during soldering

Dimensions in mm

solder resist

occupied area

solder lands