2004 Nov 04

5

NXP Semiconductors

Product data sheet

40 V, 5 A

PBSS4540X

THERMAL CHARACTERISTICS

Notes

1.

2.

Device mounted on a printed-circuit board, single-sided copper, tin-plated and standard footprint.

3.

4.

5.

mounting conditions, see “Thermal considerations for SOT89 in the General Part of associated Handbook”.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

from junction to ambient

in free air

notes 1 and 2

50

K/W

note 2

225

K/W

note 3

125

K/W

note 4

90

K/W

note 5

80

K/W

from junction to soldering point

16

K/W

006aaa232

10

1

(K/W)

10

1

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(9)

(10)

Fig.3 Transient thermal impedance as a function of pulse time; typical values.

(1)

δ = 1.

(2)

δ = 0.75.

(3)

δ = 0.5.

(4)

δ = 0.33.

(5)

δ = 0.2.

(6)

δ = 0.1.

(7)

δ = 0.05.

(8)

δ = 0.02.

(9)

δ = 0.01.

(10)

δ = 0.

Mounted on FR4 printed-circuit board; standard footprint.