© 2009 Cooper Bussmann

St. Louis, MO 63178

www.cooperbussmann.com

0609

BU-SB09345

Page 4 of 4

Data Sheet 4346

The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is

intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change

design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-

tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.

Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-

port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result

in significant injury to the user.

t

Time 25°C to Peak

Time

25°C

Preheat

A

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

T

Taabbllee 1

1 -- S

Sttaan

nddaarrdd S

SnnP

Pb

b S

Soollddeerr ((TTcc))

Volume

Volume

Packagemm

3

mm

3

Thickness

<350

>

_350

<2.5mm

235°C

220°C

>

_2.5mm

220°C

220°C

T

Taab

bllee 2

2 -- LLeeaadd ((P

Pb

b)) FFrreeee S

Soollddeerr ((TTcc))

Volume

Volume

Volume

Packagemm

3

mm

3

mm

3

Thickness

<350

350 - 2000

>2000

<1.6mm

260°C

260°C

260°C

1.6 – 2.5mm 260°C

250°C

245°C

>2.5mm

250°C

245°C

245°C

Reference JDEC J-STD-020D

Profile Feature

Standard SnPb Solder

Lead (Pb) Free Solder

Preheat and Soak• Temperature min. (Tsmin)

100°C

150°C

• Temperature max. (Tsmax)

150°C

200°C

• Time (Tsmin to Tsmax) (ts)

60-120 Seconds

60-120 Seconds

Average ramp up rate Tsmax to Tp

3°C/ Second Max.

3°C/ Second Max.

183°C

217°C

Time at liquidous (tL)

60-150 Seconds

60-150 Seconds

Peak package body temperature (TP)*

Table 1Table 2

Time (tp)** within 5 °C of the specified classification temperature (Tc)

20 Seconds**

30 Seconds**

Average ramp-down rate (Tp to Tsmax)

6°C/ Second Max.

6°C/ Second Max.

Time 25°C to Peak Temperature6 Minutes Max.

8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Solder Reflow Profile

Manual solder (rework only): solder tip 350°C maximum, 5 seconds maximum.