2004 Nov 04

5

NXP Semiconductors

Product data sheet

40 V, 5 A

PBSS5540X

THERMAL CHARACTERISTICS

Notes

1.

2.

Device mounted on a printed-circuit board, single-sided copper, tin-plated and standard footprint.

3.

4.

5.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to

ambient

in free air

notes 1 and 2

50

K/W

note 2

225

K/W

note 3

125

K/W

note 4

90

K/W

note 5

80

K/W

thermal resistance from junction to

soldering point

16

K/W

006aaa232

10

1

(K/W)

10

1

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(9)

(10)

Fig.3 Transient thermal impedance as a function of pulse time; typical values.

(1)

δ = 1.

(2)

δ = 0.75.

(3)

δ = 0.5.

(4)

δ = 0.33.

(5)

δ = 0.2.

(6)

δ = 0.1.

(7)

δ = 0.05.

(8)

δ = 0.02.

(9)

δ = 0.01.

(10)

δ = 0.

Mounted on FR4 printed-circuit board; standard footprint.