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XC6217A08BNR-G Datasheet(PDF) 2 Page - Torex Semiconductor |
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XC6217A08BNR-G Datasheet(HTML) 2 Page - Torex Semiconductor |
2 / 33 page 2/33 XC6217 Series * XC6217A/B type: USP-4D package XC6217A/B type: SOT-25 package XC6217C/D type: SSOT-24 package XC6217C/D type: USPN-4 package PIN NUMBER USP-4D SOT-25 SSOT-24 USPN-4 PIN NAME FUNCTION 4 1 4 4 V IN Power Input 1 5 3 1 V OUT Output 2 4 - - GO Green Operation Mode Switch 5 2 2 2 V SS Ground 3 3 1 3 CE ON/OFF Control ■PIN CONFIGURATION ■PIN ASSIGNMENT USP-4D (BOTTOM VIEW) SOT-25 (TOP VIEW) SSOT-24 (TOP VIEW) USPN-4 (BOTTOM VIEW) 1 2 3 4 VSS VOUT VIN CE 23 14 CE VSS VOUT VIN 5 VSS 2 1 3 4 CE VIN GO VOUT VSS VIN CE GO VOUT The USP-4D heat dissipation pad is recommended to solder in use of the reference mount pattern and metal mask pattern for the mounting strength and heat dissipation. GO 1 3 2 5 4 VSS VOUT VIN CE The USPN-4 is recommended to solder in use of the reference mount pattern and metal mask pattern for the mounting strength. |
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