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MCIMX351AVM4B Datasheet(PDF) 1 Page - Freescale Semiconductor, Inc |
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MCIMX351AVM4B Datasheet(HTML) 1 Page - Freescale Semiconductor, Inc |
1 / 148 page Freescale Semiconductor Data Sheet: Technical Data Document Number: MCIMX35SR2AEC Rev. 8, 04/2010 MCIMX35 Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information. © Freescale Semiconductor, Inc., 2010. All rights reserved. 1 Introduction The i.MX35 Auto Application Processor family is designed for automotive infotainment and navigation applications. These processors are AECQ100 Grade 3 qualified and rated for ambient operating temperatures up to 85 °C. Based on an ARM11 microprocessor core running at up to 532 MHz, the device offers the following features and optimized system cost for the target applications. • Audio connectivity and telematics: — Compressed audio playback from storage devices (CD, USB, HDD or SD card) — PlayFromDevice (1-wire and 2-wire support) for portable media players — iPod/iPhone control and playback — High-speed CD ripping to USB, SD/MMC or HDD for virtual CD changer i.MX35 Applications Processors for Automotive Products Silicon Revisions 2.0 and 2.1 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2. Functional Description and Application Information . . . . . 5 2.1. Application Processor Domain Overview . . . . . . . . 5 2.2. Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6 2.3. Advanced Power Management Overview . . . . . . . . 6 2.4. ARM11 Microprocessor Core . . . . . . . . . . . . . . . . . 6 2.5. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. Signal Descriptions: Special Function Related Pins . . . . 12 4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 13 4.1. i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 13 4.2. Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.3. Supply Power-Up/Power-Down Requirements and Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.4. Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.5. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 19 4.6. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 20 4.7. I/O Pin DC Electrical Characteristics . . . . . . . . . . 21 4.8. I/O Pin AC Electrical Characteristics . . . . . . . . . . 24 4.9. Module-Level AC Electrical Specifications . . . . . . 30 5. Package Information and Pinout . . . . . . . . . . . . . . . . . 131 5.1. MAPBGA Production Package 1568-01, 17 × 17 mm, 0.8 Pitch . . . . . . . . . . . . . . . . . . . . . 132 5.2. MAPBGA Signal Assignments . . . . . . . . . . . . . . 133 6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . 145 7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 |
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