1801 Morgan Street

Rockford, Illinois 61102

800-435-2931

www.molexkits.com

Datasheet for 76650-0146

Features and Benefits

Applications

• First-mate/last-break circuits

provide sequential engagement of

contacts for design flexibility

• Robust alignment features virtually

eliminate contact damage

• Very low profile

• Panel mounting feature permits up to

3.00mm (.120") misalignment in horizontal

and vertical directions permiting blind-

mating of products as connectors can self-

align

• Anti-fishhooking design

• Polarized guide posts on ends provide

generous 2.0mm radial lead-in for blind

mating

• Chamfered lead-in on tails for PCB

mounting

• Press-fit retention pegs for mechanical

hold down before and after processing

• Surface Mount Compatible

• Polarized D-shape leaf contact for parallel

board packaging

• Mates to standard .062" PCB card edge

• Telecommunications

-Hubs

-Servers

-Routers

• Other Markets

-Fan-tray assemblies

-Low-current blind-mating applications

-Lower-current power supply applications

• Consumer (General)

• Vending and Gaming

• Business Machines

• High-End Computer

• Production Equipment

SPOX BMI connectors offer self-aligning features in one of the smallest blind-mate

packages available. The unique low-profile design of the SPOX Blind-mate

Interface (BMI) allows for a mated stack distance of only 11.00mm (0.430").

Utilizing proven SPOXstyle contacts for high reliability, the products are suitable for

situations requiring highly reliable tin interfaces.

The Molex EBBI 50D series meets the market demand for low-cost, unshielded,

high density, leaf-style connectors. Leaf-style terminals are arranged in two rows on

.050" spacing within a polarized "D"- shaped housing for rugged mechanical

protection. Housings are made of high-temperature, UL 94V-0 thermoplastic.

Terminals are plated with 30 micro-inches min. gold in the mating area for long

term reliability and durability.

The Mini-Fit BMI is designed for high current/ high density applications requiring the

blind mating of modules, subassemblies or printed circuit boards. The Mini-Fit BMI

allows a misalignment of up to .100". It is appropriate for both power and signal

applications as it can carry currents of up to 9.0A per circuit and has a

10mW contact resistance.

Micro-Fit 3.0 BMI™ 3.00mm (.118") pitch connectors are the perfect choice

when you need compact connectors that carry up to 5 amperes of current.

Product Highlights

For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com

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