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AS1337A-BTDT Datasheet(PDF) 3 Page - ams AG |
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AS1337A-BTDT Datasheet(HTML) 3 Page - ams AG |
3 / 14 page www.austriamicrosystems.com/DC-DC_Step-Up/AS1337 Revision 1.04 3 - 14 AS1337 Datasheet - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3. Absolute Maximum Ratings Parameter Min Max Units Notes VIN to GND -0.3 5.5 V FB to GND -0.3 5 V All other pins to GND -0.3 6 V Operating Temperature Range -40 +85 ºC Storage Temperature Range -65 +125 ºC Package Body Temperature +260 ºC The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD- 020D “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin (100% Sn). Latch-Up -100 100 mA @85°C, JEDEC 78 Human Body Model 2kV HBM MIL-Std. 883E 3015.7 methods |
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