PROVISIONAL ISSUE A - MAY 2001

ZXM66P02N8

2

THERMAL RESISTANCE

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient (a)

80

°C/W

Junction to Ambient (b)

50

°C/W

NOTES

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,

in still air conditions

(b) For a device surface mounted on FR4 PCB measured at t 10 secs.

(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10 s - pulse width limited by maximum

junction temperature.

ABSOLUTE MAXIMUM RATINGS.

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

V

DSS

-20

V

Gate- Source Voltage

V

GS

±12

V

Continuous Drain Current V

V

V

I

D

-8.0

-6.5

-6.4

A

Pulsed Drain Current (c)

I

DM

-28

A

Continuous Source Current (Body Diode)(b)

I

S

-4.15

A

Pulsed Source Current (Body Diode)(c)

I

SM

-28

A

Power Dissipation at T

Linear Derating Factor

P

D

1.56

12.5

W

mW/°C

Power Dissipation at T

Linear Derating Factor

P

D

2.5

20

W

mW/°C

Operating and Storage Temperature Range

T

-55 to +150

°C