7

B

Recommended Temperature Profile

(soldering requirements)

qBoard

Dimensions: 50X33X0.8(mm)

Material: glass epoxy

qCream soldering

Composition: Sn 96.5 / Ag 3.0 / Cu 0.5

Metal mask thickness: 0.15mm

qReflow method

IR reflow

qMeasurement spot of setting temperature

Housing (mold) surface

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

03/2009