ZXMN3A01E6

ISSUE 1 - MARCH 2002

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient (a)

R

θJA

113

°C/W

Junction to Ambient (b)

R

θJA

70

°C/W

NOTES

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions

(b) For a device surface mounted on FR4 PCB measured at t 10 secs.

(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10 s - pulse width limited by maximum junction temperature. Refer to

Transient Thermal Impedance graph.

THERMAL RESISTANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

VDSS

30

V

Gate Source Voltage

VGS

20

V

Continuous Drain Current VGS=10V; TA=25°C (b)

VGS=10V; TA=70°C (b)

VGS=10V; TA=25°C (a)

ID

3.0

2.4

2.4

A

Pulsed Drain Current (c)

IDM

10

A

Continuous Source Current (Body Diode) (b)

IS

2.4

A

Pulsed Source Current (Body Diode) (c)

ISM

10

A

Power Dissipation at TA=25°C (a)

Linear Derating Factor

PD

1.1

8.8

W

mW/°C

Power Dissipation at TA=25°C (b)

Linear Derating Factor

PD

1.7

13.6

W

mW/°C

Operating and Storage Temperature Range

Tj:Tstg

-55 to +150

°C

ABSOLUTE MAXIMUM RATINGS.