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0-273-141-043 Datasheet(PDF) 5 Page - List of Unclassifed Manufacturers

Part No. 0-273-141-043
Description  Digital, triaxial acceleration sensor
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Maker  ETC2 [List of Unclassifed Manufacturers]
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Data sheet
BMA150
Triaxial, digital acceleration sensor
Bosch Sensortec
Rev. 1.5
Page 5
30 May 2008
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
1. Specification
If not stated otherwise, the given values are maximum values over lifetime and full performance
temperature/voltage range in the normal operation mode.
Table 1: Operating range, output signal and mechanical specifications of BMA150
Parameter
Symbol
Condition
Min
Typ
Max
Units
OPERATING RANGE
gFS2g
-2
2
g
gFS4g
-4
4
g
Acceleration range
gFS8g
Switchable via serial
digital interface
-8
8
g
Supply voltage
analogue
VDD
2.4
3.6
V
Supply voltage for
digital I/O
VDDIO
VDDIO
≤ VDD
1.62
3.6
V
Supply current in
normal mode
IDD
Digital and analog
200
290
µA
Supply current in
stand-by mode *
IDDsbm
Digital and analog
1
2
µA
Operating
temperature
TA
-40
+85
°C
ACCELERATION OUTPUT SIGNAL
Acceleration output
resolution
Format:
2’s complement
10
Bit
S2g
g-range ±2g
246
256
266
LSB/g
S4g
g-range ±4g
122 **
128
134 **
LSB/g
Sensitivity
S8g
g-range ±8g
61 **
64
67 **
LSB/g
Zero-g offset
Off
TA=25°C, calibrated
-60
60
mg
Zero-g offset
Off
TA=25°C , over
lifetime ***
-150
150
mg
Zero-g offset
temperature drift
Over TA
1
mg/K
Power supply
rejection ratio
PSRR
Over VDD
0.2
LSB/V
* For more details on the BMA150’s current consumption during wake-up mode, please refer to chapter 7.2 & 7.3
** Values here are given as indications for reference only
*** The offset can deviate from the original calibration mainly due to stress effects during soldering depending on the
soldering process. For many applications it is beneficial to re-calibrate the offset after PCB assembly (see application
note ANA016 “In-line offset re-calibration”).




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