- 10 -

Product Guide

Consumer Memory

Apr. 2010

TOP VIEW

BOTTOM VIEW

60Ball FBGA (For DDR2 x8)

7.50

± 0.10

0.35

1.10

#A1

7.50

± 0.10

0.80

1.60

(0.95)

(1.90)

# A1 INDEX MARK

(Datum A)

(Datum B)

MOLDING AREA

A

B

1

2

3

4

5

6

7

8

9

B

C

D

E

F

G

H

J

K

L

A

0.80 x 8 = 6.40

60-

∅0.45 Solder ball

0.2 M AB

(Post reflow 0.50

± 0.05)

Units : Millimeters

TOP VIEW

BOTTOM VIEW

84Ball FBGA (For DDR2 128Mb O-die/256Mb N-die/512Mb G-die, I-die/1Gb E-die)

0.35

1.10

7.50

± 0.10

#A1

7.50

± 0.10

1

2

3

4

5

6

7

8

9

3.20

0.80

1.60

(0.95)

(1.90)

# A1 INDEX MARK

(Datum A)

(Datum B)

MOLDING AREA

A

B

0.80 x 8 = 6.40

B

C

D

E

F

G

H

K

L

N

A

J

M

P

R

84-

∅0.45 Solder ball

0.2 M AB

(Post reflow 0.50

± 0.05)

Units : Millimeters