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K4S281632K Datasheet(PDF) 10 Page - Samsung semiconductor |
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K4S281632K Datasheet(HTML) 10 Page - Samsung semiconductor |
10 / 15 page - 10 - Product Guide Consumer Memory Apr. 2010 TOP VIEW BOTTOM VIEW 60Ball FBGA (For DDR2 x8) 7.50 ± 0.10 0.35 ±0.05 1.10 ±0.10 #A1 7.50 ± 0.10 0.80 1.60 (0.95) (1.90) # A1 INDEX MARK (Datum A) (Datum B) MOLDING AREA A B 1 2 3 4 5 6 7 8 9 B C D E F G H J K L A 0.80 x 8 = 6.40 60- ∅0.45 Solder ball 0.2 M AB (Post reflow 0.50 ± 0.05) Units : Millimeters TOP VIEW BOTTOM VIEW 84Ball FBGA (For DDR2 128Mb O-die/256Mb N-die/512Mb G-die, I-die/1Gb E-die) 0.35 ±0.05 1.10 ±0.10 7.50 ± 0.10 #A1 7.50 ± 0.10 1 2 3 4 5 6 7 8 9 3.20 0.80 1.60 (0.95) (1.90) # A1 INDEX MARK (Datum A) (Datum B) MOLDING AREA A B 0.80 x 8 = 6.40 B C D E F G H K L N A J M P R 84- ∅0.45 Solder ball 0.2 M AB (Post reflow 0.50 ± 0.05) Units : Millimeters |
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