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K4Y50024UE-JC Datasheet(PDF) 3 Page - Samsung semiconductor |
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K4Y50024UE-JC Datasheet(HTML) 3 Page - Samsung semiconductor |
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3 / 3 page  General Information XDRTM DRAM B. XDR DRAM Component Product Guide Density Banks Part Number Speed*2 Org. Power(V) Refresh Package Type Availability 256Mb(F-die) 8 Banks K4Y54044UF-J*1C A2/ B3/ C4 64Mx4 1.8V± 0.09 16K/16ms 104ball BOC EOL K4Y54084UF-JC 32Mx8 K4Y54164UF-JC 16Mx16 512Mb(C-die) 8 Banks K4Y50024UC-JC A2/ B3/ C4 256Mx2 1.8V± 0.09 32K/16ms 104ball BOC Now K4Y50044UC-JC 128Mx4 K4Y50084UC-JC 64Mx8 K4Y50164UC-JC 32Mx16 512Mb(E-die) 8 Banks K4Y50024UE-JC A2/ B3/ C4 256Mx2 1.8V± 0.09 32K/16ms 100ball BOC Q4’06 K4Y50044UE-JC 128Mx4 K4Y50084UE-JC 64Mx8 K4Y50164UE-JC 32Mx16 *1 Package Type Code Description J BOC lead free *2 Speed ( tRAC & Freq.) Code Description (Data frequency. tRAC, tRC) C4 4000Mbps, -28, 24clks B3 3200Mbps, -35, 20clks C3 3200Mbps, -35, 24clks A2 2400Mbps, -36, 16clks |
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