General Information

SDRAM

November 2007

B. SDRAM Component Product Guide

Density

Bank

Part Number

Org.

Interface

Refresh

Power (V)

Package

Avail.

64Mb K-die

4Banks

K4S640832K

UC75

UL75

8M x 8

LVTTL

4K/64ms

3.3

± 0.3V

Lead-free 54pin TSOP(II)

EOL

DEC. ’08

K4S641632K

UC50/C60/C75

UL50/L60/L75

4M x 16

64Mb N-die

4Banks

K4S640832N

LC75

LL75

8M x 8

LVTTL

4K/64ms

3.3

± 0.3V

Lead-free & Halogen-

free

54pin TSOP(II)

4Q’07

CS

K4S641632N

LC50/C60/C75

LL50/L60/L75

4M x 16

128Mb I-die

4Banks

K4S280432I

UC75

UL75

32M x 4

LVTTL

4K/64ms

3.3

± 0.3V

Lead-free 54pin TSOP(II)

EOL

AUG. ’08

K4S280832I

UC75

UL75

16M x 8

K4S281632I

UC60/C75

UL60/L75

8M x 16

128Mb K-die

4Banks

K4S280432K

UL75

32M x 4

LVTTL

4K/64ms

3.3

± 0.3V

Lead-free & Halogen-

free

Now

K4S280832K

UC75

UL75

16M x 8

K4S281632K

UC60/C75

UL60/L75

8M x 16

256Mb H-die

4Banks

K4S560432H

UC75

UL75

64M x 4

LVTTL

8K/64ms

3.3

± 0.3V

Lead-free 54pin TSOP(II)

EOL

SEP. ’08

K4S560832H

UC75

UL75

32M x 8

K4S561632H

UC60/C75

UL60/L75

16M x 16

256Mb J-die

4Banks

K4S560432J

UL75

64M x 4

LVTTL

8K/64ms

3.3

± 0.3V

Lead-free & Halogen-

free

Now

K4S560832J

UC75

UL75

32M x 8

K4S561632J

UC60/C75

UL60/L75

16M x 16

512Mb D-die

4Banks

K4S510432D

UC75

UL75

128M x 4

LVTTL

8K/64ms

3.3

± 0.3V

Lead-free 54pin TSOP(II)

Now

K4S510832D

UC75

UL75

64M x 8

K4S511632D

UC75

UL75

32M x 16

Note 2 :

Temperature and Power

Description

C

Temperature, Normal Power

L

Temperature, Low Power

Note 1 :

U : TSOP(II) (Lead-free)

L : TSOP(II) (Lead-free & Halogen-free)

Note 3 :

* All products have backward compatibility with PC100.

Speed

Description

75

7.5ns, PC133 (133Mhz @ CL=3)

60

6.0 ns (166Mhz @ CL=3)

50

5.0 ns (200Mhz @ CL=3)

- Commercial Temp (0

°C < Ta < 70°C)

Note 4 : 128Mb K-die SDR and 256Mb J-die SDR DRAMs support Lead-free & Halogen-free package with Lead-free package code(-U)