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CC2591RGVTG4 Datasheet(PDF) 4 Page - Texas Instruments |
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CC2591RGVTG4 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 18 page DEVICE INFORMATION AVDD_PA1 1 2 3 4 12 11 10 9 5 6 7 8 16 15 14 13 QFN-16 4x4mm RF_N RXTX RF_P GND ANT GND AVDD_PA2 CC2591 SWRS070A – MARCH 2008 – REVISED JUNE 2008 ........................................................................................................................................................ www.ti.com The CC2591 pinout and description are shown in Figure 1 and Table 1, respectively. PIN AND I/O CONFIGURATION (TOP VIEW) Figure 1. NOTE: The exposed die attach pad must be connected to a solid ground plane as this is the primary ground connection for the chip. Inductance in vias to the pad should be minimized. It is highly recommended to follow the reference layout. Changes will alter the performance. Also see the PCB landpattern information in this data sheet. For best performance, minimize the length of the ground vias, by using a 4-layer PCB with ground plane as layer 2 when CC2591 is mounted onto layer 1. 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2591 |
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