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MAX6630MUT Datasheet(PDF) 7 Page - Maxim Integrated Products |
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MAX6630MUT Datasheet(HTML) 7 Page - Maxim Integrated Products |
7 / 8 page Applications Information Thermal Considerations The key to accurate temperature monitoring is good thermal contact between the MAX6629–MAX6632 pack- age and the object being monitored. In some applica- tions, the 6-pin SOT23 package is small enough to fit underneath a socketed µP, allowing the device to moni- tor the µP’s temperature directly. Accurate temperature monitoring depends on the thermal resistance between the object being monitored and the MAX6629–MAX6632 die. Heat flows in and out of plastic packages primarily through the leads. If the sensor is intended to measure the temperature of a heat-generating component on the circuit board, it should be mounted as close as possible to that component and should share supply and ground traces (if they are not noisy) with that component where possible. This maximizes the heat transfer from the com- ponent to the sensor. The MAX6629/MAX6630 supply current is typically 200µA, and the MAX6631/MAX6632 supply current is typically 32µA. When used to drive high-impedance loads, the device dissipates negligible power. Therefore, the die temperature is essentially the same as the package temperature. The rise in die temperature due to self-heating is given by the following formula: ΔTJ = PDISSIPATION x θJA where PDISSIPATION is the power dissipated by the MAX6629–MAX6632, and θJA is the package’s thermal resistance. The typical thermal resistance is +110°C/W for the 6-pin SOT23 package. To limit the effects of self-heat- ing, minimize the output currents. For example, if the MAX6629–MAX6632 sink 1mA, the output voltage is guaranteed to be less than 0.4V. Therefore, an addi- tional 0.4mW of power is dissipated within the IC. This corresponds to a 0.044°C shift in the die temperature in the 6-pin SOT23. Chip Information PROCESS: BiCMOS Package Information For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. 12-Bit + Sign Digital Temperature Sensors with Serial Interface _______________________________________________________________________________________ 7 VOLTAGE REFERENCE SPI-COMPATIBLE INTERFACE TEMPERATURE SENSOR 12-BIT + SIGN ∑ΔADC MAX6629 MAX6630 MAX6631 MAX6632 SO SCK CS Functional Diagram PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 6 SOT23 U6FH-6 21-0058 6 TDFN-EP T633+2 21-0137 |
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