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OPA4330AID Datasheet(PDF) 11 Page - Texas Instruments |
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OPA4330AID Datasheet(HTML) 11 Page - Texas Instruments |
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11 / 29 page  OPA330 3V 1MW 60kW 100kW 1MW NTC Thermistor IN - IN+ OUT V S - V + S C3 B2 A3 C1 A1 YFFPACKAGE WCSP-5 (TOPVIEW) (Bumpsidedown; nottoscale) ActualSize: ExactSize(max): 0,862mmx1,156mm YFFPACKAGE WCSP-5EnlargedImage (TopView) (Bumpsidedown) PackageMarkingCode: YMD=year/month/day TBD=indicatesOPA330AIYFF S=forengineeringpurposesonly OPA330 OPA2330 OPA4330 www.ti.com SBOS432D – AUGUST 2008 – REVISED JUNE 2010 RN are operational resistors used to isolate the Following these guidelines reduces the likelihood of ADS1100 from the noise of the digital I2C bus. junctions being at different temperatures, which can Because the ADS1100 is a 16-bit converter, a precise cause thermoelectric voltages of 0.1mV/°C or higher, reference is essential for maximum accuracy. If depending on materials used. absolute accuracy is not required, and the 5V power supply is sufficiently stable, the REF3130 may be OPA330 WCSP omitted. The OPA330 YFF package is a lead- (Pb-) free, Figure 23 shows the OPA330 in a typical thermistor die-level, wafer chip-scale package (WCSP). Unlike circuit. devices that are in plastic packages, these devices have no molding compound, lead frame, wire bonds, or leads. Using standard surface-mount assembly procedures, the WCSP can be mounted to a printed circuit board (PCB) without additional underfill. Figure 24 and Figure 25 detail the pinout and package marking, respectively. See the NanoStar™ and NanoFree™ 300mm Solder Bump WCSP Application Note (SBVA017) for more detailed information on package characteristics and PCB design. Figure 23. Thermistor Measurement GENERAL LAYOUT GUIDELINES Attention to good layout practice is always recommended. Keep traces short and, when possible, use a printed circuit board (PCB) ground plane with surface-mount components placed as close to the device pins as possible. Place a 0.1mF capacitor closely across the supply pins. These guidelines should be applied throughout the analog circuit to improve performance and provide benefits such as reducing the electromagnetic interference Figure 24. WCSP Pin Description (EMI) susceptibility. For lowest offset voltage and precision performance, circuit layout and mechanical conditions should be optimized. Avoid temperature gradients that create thermoelectric (Seebeck) effects in the thermocouple junctions formed from connecting dissimilar conductors. These thermally-generated potentials can be made to cancel by assuring they are equal on both input terminals. Other layout and design considerations include: • Use low thermoelectric-coefficient conditions (avoid dissimilar metals). • Thermally isolate components from power Figure 25. YFF Package Marking supplies or other heat sources. • Shield op amp and input circuitry from air currents, such as cooling fans. Copyright © 2008–2010, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s): OPA330 OPA2330 OPA4330 |
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