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IC264-22501-1 Datasheet(PDF) 1 Page - Yamaichi Electronics Co., Ltd. |
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IC264-22501-1 Datasheet(HTML) 1 Page - Yamaichi Electronics Co., Ltd. |
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1 / 1 page Test & Burn-In Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test & Burn-In Test & Burn-In IC264 Series (Open Top) 100V AC for 1 minute W 1 max. at 10mA/20mV max. –40°C to +150°C 10,000 insertions min. 225 contact pins Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: Contact Force: 25g to 35g per individual contact pin W 1,000M min. at 100V DC Matching IC Dimensions Housing: Contacts: Plating: Polyetherimide (PEI), glass-filled Beryllium Copper (BeCu) Gold over Nickel Series No. No. of Contact Pins Design Number NN: NP: PN: Blank: Without Positioning Pin #1, #2 Without Positioning Pin #1, With Positioning Pin #2 With Positioning Pin #1, Without Positioning Pin #2 MF = Flanged Unmarked = Not Flanged With Positioning Pin #1, #2 IC264 225 01 ** 1 MF - - - - Materials and Finish IC264-22501-1-**-** 56.0±0.1 25.0 50.0 4- Æ2.8 4-R 3.0 32.5±0.05 56.0±0.05 4- Æ2.8 4- Æ2.0 2- Æ1.5 225- Æ0.6 +0.1 0 +0.1 0 +0.1 0 +0.1 0 28.0±0.05 Æ 0.75±0.1 1.50±0.1 1.50x14=21.00 27.00 ±0.2 Ball Grid Array (BGA, 1.50mm Pitch) NP276 Series (Open Top) Since the solder balls are touched by two contacts on each side, the solder ball damage can be minimized; additional features are low actuation force and compact socket size IC Ball Socket Base A Contacts Socket Base B Typical NP276 Base Sockets Yamaichi's 2-point Tweezer Contact 100V AC for 1 minute W 30m max. at 10mA/20mV max. –55°C to +150°C –40°C to +170°C Features Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: W 1,000M min. at 100V DC Housing: Contacts: Plating: Polyetherimide (PEI), glass-filled Polyethersulphone (PES), glass-filled Beryllium Copper (BeCu) Gold over Nickel Series No. No. of Contact Pins (.AC-types are depopulated base sockets) Design Number NP276 1105 * 22 - - Materials and Finish í Open top type sockets for BGA packages í Self contacting structure without upper pressing force (ZIF) í Contacting structure to nip the sides of solder balls to lower damage to the coplanarity of the solder balls Contact Force: Mating Cycles: 30g per pin approx. 10,000 insetions Ball Grid Array (BGA, 1.27mm Pitch) Positioning Pin Options (see PCB): Pos. pin 'A' 1 = 2 = 3 = 4 = With With Without Without With Without With Without Pos. pin 'B' Contact Terminal Length and Form (*) - Top View from Socket Specifications Specifications Outline Socket Dimensions Recommended PC Board Layout Part Number (Details) Part Number (Details) D-9 |
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