Test & Burn-In

Test & Burn-In

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

Test & Burn-In

Test & Burn-In

100V AC for 1 minute

W

1

max. at 10mA/20mV max.

–40°C to +150°C

10,000 insertions min.

225 contact pins

Insulation Resistance:

Dielectric Withstanding Voltage:

Contact Resistance:

Operating Temperature Range:

Mating Cycles:

Pin Count:

Contact Force:

25g to 35g per individual

contact pin

W

1,000M

min. at 100V DC

Matching IC Dimensions

Housing:

Contacts:

Plating:

Polyetherimide (PEI), glass-filled

Beryllium Copper (BeCu)

Gold over Nickel

Series No.

No. of Contact Pins

Design Number

NN:

NP:

PN:

Blank:

Without Positioning Pin #1, #2

Without Positioning Pin #1,

With Positioning Pin #2

With Positioning Pin #1,

Without Positioning Pin #2

MF = Flanged

Unmarked = Not Flanged

With Positioning Pin #1, #2

IC264

225 01

**

1

MF

-

-

-

-

Materials and Finish

IC264-22501-1-**-**

56.0±0.1

25.0

50.0

4- Æ2.8

4-R 3.0

32.5±0.05

56.0±0.05

4- Æ2.8

4- Æ2.0

2- Æ1.5

225- Æ0.6

+0.1

0

+0.1

0

+0.1

0

+0.1

0

28.0±0.05

Æ

0.75±0.1

1.50±0.1

1.50x14=21.00

27.00 ±0.2

Since the solder balls are touched

by two contacts on each side,

the solder ball damage can be

minimized; additional features

are low actuation force and

compact socket size

IC

Ball

Socket

Base A

Contacts

Socket

Base B

Typical NP276 Base Sockets

Yamaichi's 2-point Tweezer Contact

100V AC for 1 minute

W

30m

max. at 10mA/20mV max.

–55°C to +150°C

–40°C to +170°C

Features

Insulation Resistance:

Dielectric Withstanding Voltage:

Contact Resistance:

Operating Temperature Range:

W

1,000M

min. at 100V DC

Housing:

Contacts:

Plating:

Polyetherimide (PEI), glass-filled

Polyethersulphone (PES), glass-filled

Beryllium Copper (BeCu)

Gold over Nickel

Series No.

No. of Contact Pins

(.AC-types are depopulated

base sockets)

Design Number

NP276

1105

*

22

-

-

Materials and Finish

í Open top type sockets for BGA packages

í Self contacting structure without upper pressing force (ZIF)

í Contacting structure to nip the sides of solder balls to lower

damage to the coplanarity of the solder balls

Contact Force:

Mating Cycles:

30g per pin approx.

10,000 insetions

Positioning Pin Options (see PCB):

Pos. pin 'A'

1 =

2 =

3 =

4 =

With

With

Without

Without

With

Without

With

Without

Pos. pin 'B'

Contact Terminal Length and Form

(*)

-

Top View from Socket

Specifications

Specifications

Outline Socket Dimensions

Recommended PC Board Layout

D-9