7WB383

http://onsemi.com

8

PACKAGE DIMENSIONS

UDFN8 1.8 x 1.2, 0.4P

CASE 517AJ−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 mm FROM TERMINAL TIP.

4. MOLD FLASH ALLOWED ON TERMINALS

ALONG EDGE OF PACKAGE. FLASH MAY

NOT EXCEED 0.03 ONTO BOTTOM

SURFACE OF TERMINALS.

5. DETAIL A SHOWS OPTIONAL

CONSTRUCTION FOR TERMINALS.

A B

E

D

BOTTOM VIEW

b

e

8X

B

A

C

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

A

A1

(A3)

0.05 C

0.05 C

PLANE

SIDE VIEW

L

8X

1

4

5

8

DIM MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

A3

0.127 REF

b

0.15

0.25

D

1.80 BSC

E

1.20 BSC

e

0.40 BSC

L

0.45

0.55

e/2

b2

0.30 REF

L1

0.00

0.03

L2

0.40 REF

DETAIL A

(L2)

(b2)

NOTE 5

L1

DETAIL A

M

0.10

M

0.05

0.22

0.32

8X

1.50

0.40 PITCH

0.66

DIMENSIONS: MILLIMETERS

MOUNTING FOOTPRINT*

7X

1

SOLDERMASK DEFINED

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.