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Document Number: 45157

4

Revision: 15-Jun-10

VJ 6040

Vishay Vitramon

VJ 6040 UHF Chip Antenna for Mobile Devices

FOOTPRINT AND MECHANICAL DIMENSIONS

The antenna footprint and mechanical dimensions are presented in figure 6. For mechanical support, it is recommended to add

one or two drops of heat curing epoxy glue. The glue dot should not overlap with any of the soldering pads. It is recommended

to apply the glue dot at the center of the antenna, as shown by the diagonal pattern. For more details see “VJ 6040 Assembly

Guidelines” section below.

Fig. 6 - VJ 6040 Footprint

VJ 6040 ASSEMBLY GUIDELINES

1. Mounting of antennas on a printed circuit board should be done by reflow soldering. The reflow soldering profiles are shown

below.

2. In order to provide the adequate strength between the antenna and the PCB the application of a dot of heat cured epoxy glue

in the center of the footprint of the antenna prior to the antenna's soldering to the board should be done. An example for such

glue could be Heraeus PD 860002 SA. The weight of the dot should be 5 mg to 10 mg.

Fig. 7 - Soldering IR Reflow with SnPb Solder

0.35

1.0

0.35

0.35

0.35

`

0.35

1.0

1.0

1.0

RF feed connects here

4.65

4.6

1.0

0.35

All dimensions in mm

Figure not in scale

4.65

0.5

3.6

3.6

0.5

0.5

Glue dot area

Time

30 s to 60 s

30 s to 60 s

30 s to 60 s

0

50

100

150

200

250

300

T

(°C)

> 215 °C: 20 s to 40 s

Max. temperature

Min. temperature

Sn-Pb eutectic solder paste