ADT7475ARQZ-REEL datasheet(2/58 Pages) ONSEMI

Part #	ADT7475ARQZ-REEL

Description	dBCOOL Remote Thermal Monitor and Fan Controller

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Manufacturer	ONSEMI [ON Semiconductor]

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ADT7475

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Figure 1. Functional Block Diagram

BAND GAP

REFERENCE

10−BIT

ADC

VALUE AND

LIMIT

REGISTERS

INTERRUPT

STATUS

REGISTERS

GND

PWM1

PWM2

PWM3

PWM

REGISTERS

AND

CONTROLLERS

(HF AND LF)

ACOUSTIC

ENHANCEMENT

CONTROL

AUTOMATIC

FAN SPEED

CONTROL

TACH1

TACH2

TACH3

TACH4

FAN

SPEED

COUNTER

THERMAL

PROTECTION

PERFORMANCE

MONITORING

THERM

INPUT

SIGNAL

CONDITIONING

AND

ANALOG

MULTIPLEXER

VCC TO ADT7475

VCC

D1+

D1–

D2+

D2–

VCCP

BAND GAP

TEMPERATURE

SENSOR

INTERRUPT

MASKING

PWM

CONFIGURATION

REGISTERS

ADDRESS

POINTER

REGISTER

SERIAL BUS

INTERFACE

SCL SDA SMBALERT

ADT7475

LIMIT

COMPARATORS

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

Positive Supply Voltage (VCC)

3.6

V

Voltage on Any Input or Output Pin

−0.3 to +3.6

V

Input Current at Any Pin

±5

mA

Package Input Current

±20

mA

Maximum Junction Temperature (TJMAX)

150

°C

Storage Temperature Range

−65 to +150

°C

Lead Temperature, Soldering

IR Reflow Peak Temperature

Lead Temperature (Soldering, 10 sec)

260

300

°C

ESD Rating

1500

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

Package Type

qJA

qJC

Unit

16−lead QSOP

150

39

°C/W

1. qJA is specified for the worst−case conditions, that is, a device soldered in a circuit board for surface−mount packages.

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ADT7475ARQZ-REEL Datasheet(PDF) 2 Page - ON Semiconductor

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