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AMIS30660CANH2RG Datasheet(PDF) 3 Page - ON Semiconductor |
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AMIS30660CANH2RG Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 10 page AMIS−30660 http://onsemi.com 3 Table 3. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Conditions Min Max Unit VCC Supply Voltage −0.3 +7 V VCANH DC Voltage at Pin CANH 0 < VCC < 5.25 V; No Time Limit −45 +45 V VCANL DC Voltage at Pin CANL 0 < VCC < 5.25 V; No Time Limit −45 +45 V VTxD DC Voltage at Pin TxD −0.3 VCC + 0.3 V VRxD DC Voltage at Pin RxD −0.3 VCC + 0.3 V VS DC Voltage at Pin S −0.3 VCC + 0.3 V Vref DC Voltage at Pin VREF −0.3 VCC + 0.3 V Vtran(CANH) Transient Voltage at Pin CANH (Note 2) −150 +150 V Vtran(CANL) Transient Voltage at Pin CANL (Note 2) −150 +150 V Vesd Electrostatic Discharge Voltage at All Pins (Note 3) (Note 5) −4 −500 +4 +500 kV V Latchup Static Latchup at All Pins (Note 4) 100 mA Tstg Storage Temperature −55 +155 °C Tamb Ambient Temperature −40 +125 °C TJunc Maximum Tunction Temperature −40 +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2. Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4). 3. Standardized human body model ESD pulses in accordance to MIL883 method 3015.7. 4. Static latch−up immunity: static latch−up protection level when tested according to EIA/JESD78. 5. Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3−1993. Table 4. THERMAL CHARACTERISTICS Symbol Parameter Conditions Value Unit Rth(vj−a) Thermal Resistance from Junction−to−Ambient in SOIC−8 Package In Free Air 150 K/W Rth(vj−s) Thermal resistance from Junction−to−Substrate of Bare Die In Free Air 45 K/W AMIS− 30660 CANH CANL GND RxD TxD Vref 2 1 3 45 6 7 8 PC20040918.2 VCC S CAN controller VBAT 5V−reg IN OUT 47 nF 60 W 60 W CAN BUS 47 nF 60 W 60 W VCC GND Figure 2. Application Diagram |
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