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MBR30L45CTG Datasheet(PDF) 2 Page - ON Semiconductor |
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MBR30L45CTG Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 6 page MBR30L45CTG, MBRF30L45CTG http://onsemi.com 2 MAXIMUM RATINGS (Per Diode Leg) Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 45 V Average Rectified Forward Current (Rated VR) TC = 137°C IF(AV) 15 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz) IFRM 30 A Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 190 A Operating Junction Temperature (Note 1) TJ −55 to +150 °C Storage Temperature Tstg *55 to +175 °C Voltage Rate of Change (Rated VR) dv/dt 10,000 V/ms ESD Ratings: Machine Model = C Human Body Model = 3B > 400 > 8000 V THERMAL CHARACTERISTICS Maximum Thermal Resistance (MBR30L45CTG) Junction−to−Case Junction−to−Ambient (MBRF30L45CTG) Junction−to−Case RqJC RqJA RqJC 1.9 45 2.2 °C/W ELECTRICAL CHARACTERISTICS (Per Diode Leg) Maximum Instantaneous Forward Voltage (Note 2) (IF = 15 A, TC = 25°C) (IF = 15 A, TC = 125°C) (IF = 30 A, TC = 25°C) (IF = 30 A, TC = 125°C) vF 0.50 0.44 0.61 0.60 V Maximum Instantaneous Reverse Current (Note 2) (Rated DC Voltage, TC = 25°C) (Rated DC Voltage, TC = 125°C) iR 0.65 250 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤2.0%. |
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