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MMZ1608Y221B Datasheet(PDF) 1 Page - TDK Electronics

Part # MMZ1608Y221B
Description  Chip Beads(SMD) For Signal Line
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Manufacturer  TDK [TDK Electronics]
Direct Link  http://www.tdk.com
Logo TDK - TDK Electronics

MMZ1608Y221B Datasheet(HTML) 1 Page - TDK Electronics

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012-01 / 20100324 / e9412_mmz1608.fm
• All specifications are subject to change without notice.
Chip Beads(SMD)
For Signal Line
MMZ Series MMZ1608 Type
FEATURES
• Chip bead(impeder), MMZ series offers 7 construction materials.
• Size standardized for use by automatic assembly equipment.
No preferred orientation.
• Either flow or reflow soldering methods can be used due to
electroplating of the terminal electrodes.
• High reliability due to an entirely monolithic structure.
• Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
• Low DC resistance structure of electrode prevents wasteful
electric power consumption.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L
×W
(3) Material code
(4) Nominal impedance
121:120
Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Conformity to RoHS Directive
MMZ 1608 R 121
A
T
(1)
(2)
(3) (4)
(5) (6)
Operating/storage
–55 to +125°C
Packaging style
Quantity
Taping
4000 pieces/reel
0.3
±0.2
1.6
±0.15
0.8
0.6
0.6
Dimensions in mm
Thickness(T)
Weight
0.6
±0.15mm
0.8
±0.15mm
3mg
4mg
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.


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