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MMSF3P02HDR2 Datasheet(PDF) 2 Page - ON Semiconductor

Part # MMSF3P02HDR2
Description  Power MOSFET 3 Amps, 20 Volts P?묬hannel SO??
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MMSF3P02HDR2 Datasheet(HTML) 2 Page - ON Semiconductor

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MMSF3P02HD
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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 3)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
(VGS = 0 Vdc, ID = 250 mAdc)
Temperature Coefficient (Positive)
V(BR)DSS
20
24
Vdc
mV/
°C
Zero Gate Voltage Drain Current
(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 125°C)
IDSS
1.0
10
mAdc
Gate−Body Leakage Current (VGS = ± 20 Vdc, VDS = 0)
IGSS
100
nAdc
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
(VDS = VGS, ID = 250 mAdc)
Temperature Coefficient (Negative)
VGS(th)
1.0
1.5
4.0
2.0
Vdc
mV/
°C
Static Drain−Source On−Resistance
(VGS = 10 Vdc, ID = 3.0 Adc)
(VGS = 4.5 Vdc, ID = 1.5 Adc)
RDS(on)
0.06
0.08
0.075
0.095
W
Forward Transconductance (VDS = 3.0 Vdc, ID = 1.5 Adc)
gFS
3.0
7.2
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 16 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Ciss
1010
1400
pF
Output Capacitance
Coss
740
920
Transfer Capacitance
Crss
260
490
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
(VDD = 10 Vdc, ID = 3.0 Adc,
VGS = 4.5 Vdc, RG = 6.0 W)
td(on)
25
50
ns
Rise Time
tr
135
270
Turn−Off Delay Time
td(off)
54
108
Fall Time
tf
84
168
Turn−On Delay Time
(VDD = 10 Vdc, ID = 3.0 Adc,
VGS = 10 Vdc, RG = 6.0 W)
td(on)
16
32
Rise Time
tr
40
80
Turn−Off Delay Time
td(off)
110
220
Fall Time
tf
97
194
Gate Charge
See Figure 8
(VDS = 16 Vdc, ID = 3.0 Adc,
VGS = 10 Vdc)
QT
33
46
nC
Q1
3.0
Q2
11
Q3
10
SOURCE−DRAIN DIODE CHARACTERISTICS
Forward On−Voltage (Note 4)
(IS = 3.0 Adc, VGS = 0 Vdc)
(IS = 3.0 Adc, VGS = 0 Vdc, TJ = 125°C)
VSD
1.35
0.96
1.75
Vdc
Reverse Recovery Time
See Figure 15
(IS = 3.0 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/ms)
trr
76
ns
ta
32
tb
44
Reverse Recovery Stored Charge
QRR
0.133
mC
3. Negative sign for P−Channel device omitted for clarity.
4. Pulse Test: Pulse Width
≤ 300 ms, Duty Cycle ≤ 2%.
5. Switching characteristics are independent of operating junction temperature.


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