NB3N3002

http://onsemi.com

3

Table 3. ATTRIBUTES

Characteristic

Value

ESD Protection

Human Body Model

> 2 kV

Moisture Sensitivity, Indefinite Time Out of Dray Pack (Note 1)

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

Transistor Count

7623

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Symbol

Parameter

Condition 1

Condition 2

Rating

Units

Positive Power Supply

GND = 0 V

4.6

V

GND = 0 V

V

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

TSSOP–16

TSSOP–16

138

108

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

(Note 3)

TSSOP−16

33 to 36

°C/W

Wave Solder

265

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

2. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and not valid simultaneously. If

stress limits are exceeded device functional operation is not implied, damage may occur and reliability may be affected.

3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power).

Symbol

Characteristic

Min

Typ

Max

Unit

Power Supply Current (Note 4)

65

95

mA

Power Supply Current when OE is Set Low

35

65

mA

Input HIGH Voltage (X1/CLK, Sel0, Sel1,and OE)

mV

Input LOW Voltage (X1/CLK, Sel0, Sel1, and OE)

GND − 300

mV

Output HIGH Voltage (See Figure 4)

660

700

850

mV

Output LOW Voltage (See Figure 4)

−150

0

150

mV

Crossing Voltage Magnitude (Absolute)

250

400

mV

150

mV

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

4. NB3N circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit

is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500 lfpm is maintained.