NCN6024

http://onsemi.com

5

ATTRIBUTES

Characteristics

Values

ESD protection

Human Body Model (HBM) (Note 1)

Card Pins (Card Interface Pins 9 − 17)

All Other Pins

Machine Model (MM)

Card Pins (Card Interface Pins 9 − 17)

All Other Pins

8 kV

2 kV

400 V

150 V

Moisture sensitivity (Note 2) SOIC−28 and TSSOP−28

Level 1

Flammability Rating Oxygen

Index: 28 to 34

UL 94 V−0 @ 0.125 in

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latch−up Test

1. Human Body Model (HBM), R = 1500 W, C = 100 pF.

2. For additional information, see Application Note AND8003/D.

Rating

Symbol

Value

Unit

DC/DC Converter Power Supply Voltage

−0.3 v VDDP v 5.5

V

Power Supply from Microcontroller Side

−0.3 v VDD v 5.5

V

External Card Power Supply

CRD_VCC

−0.3 v CRD_VCC v 5.5

V

Charge Pump Output

Digital Input Pins

V

Digital Output Pins (I/Ouc, AUX1uc, AUX2uc, INT)

V

Smart Card Output Pins

V

Thermal Resistance Junction−to−Air

SOIC−28

TSSOP−28

75

76

°C/W

Operating Ambient Temperature Range

−40 to +85

°C

Operating Junction Temperature Range

−40 to +125

°C

Maximum Junction Temperature

+125

°C

Storage Temperature Range

−65 to + 150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.