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NCP571SN10T1G Datasheet(PDF) 2 Page - ON Semiconductor |
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NCP571SN10T1G Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 12 page NCP571, NCV571 http://onsemi.com 2 TSOP−5 package 1 3 NC Vin 2 GND Enable 4 Vout 5 (Top View) DFN6 package 1 3 Enable Vout 2 NC GND 4 Vin 6 (Top View) EP 5 NC PIN CONNECTIONS PIN FUNCTION DESCRIPTION DFN6 TSOP−5 Pin Name Description 1 5 Vout Regulated output voltage. 2 4 NC No Internal Connection. It is recommended to connect this pin to GND potential. 3 2 GND Power supply ground. 4 3 Enable This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable pin should be connected to Vin. 5 − NC No Internal Connection. It is recommended to connect this pin to GND potential. 6 1 Vin Positive power supply input voltage. EP − EP No Internal Connection. It is recommended to connect this pin to GND potential. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage Vin 0 to 12 V Enable Voltage VEN −0.3 to Vin + 0.3 V Output Voltage Vout −0.3 to Vin + 0.3 V Power Dissipation PD Internally Limited W Operating Junction Temperature TJ +150 °C Operating Ambient Temperature NCP571 NCV571 TA −40 to +85 −40 to +125 °C Storage Temperature Tstg −55 to +150 °C ESD Capability, Human Body Model (Note 1) ESDHBM 2000 V ESD Capability, Machine Mode (Note 1) ESDMM 200 V ESD Capability, Charged Device Model (Note 1) ESDCDM 1000 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model (Jedec Standard) 2. Latchup capability (85°C) $100 mA DC with trigger voltage. THERMAL CHARACTERISTICS Rating Symbol Test Conditions Typical Value Unit Junction−to−Ambient TSOP−5 RqJA 1 oz Copper Thickness, 100 mm2 250 °C/W PSIJ−Lead 2 TSOP−5 YJ−L2 1 oz Copper Thickness, 100 mm2 68 °C/W Junction−to−Ambient DFN6 RqJA 1 oz Copper Thickness, 100 mm2 190 °C/W PSIJ−Lead 2 DFN6 YJ−L2 1 oz Copper Thickness, 100 mm2 84 °C/W NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12. |
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