NCP694

http://onsemi.com

3

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage

6.5

V

Enable Voltage

V

Output Voltage

V

Power Dissipation SOT−89−5

900

mW

Power Dissipation HSON−6

900

mW

Operating Junction Temperature

+150

°C

Operating Ambient Temperature

−40 to +85

°C

Storage Temperature

−55 to +125

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests:

Human Body Model 2000 V per JEDEC

Machine Model Method 200 V

THERMAL CHARACTERISTICS

Rating

Symbol

Test Conditions

Typical Value

Unit

Junction−to−Ambient SOT−89−5

111

°C/W

Power Dissipation SOT−89−5

900

mW

Junction−to−Ambient HSON−6

111

°C/W

Power Dissipation HSON−6

900

mW

NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following

boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12.