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OPA4330AIDR Datasheet(PDF) 2 Page - Texas Instruments |
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OPA4330AIDR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 30 page OPA330 OPA2330 OPA4330 SBOS432D – AUGUST 2008 – REVISED JUNE 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING SOT23-5 DBV OCFQ SC70-5 DCK CHL OPA330 SOIC-8 D O330A WCSP-5 YFF OEH SOIC-8 D O2330A OPA2330 DFN-8 DRB OCGQ MSOP-8 DGK OCGQ SOIC-14 D O4330A OPA4330 TSSOP-14 PW O4330A OPA4330 QFN-14(2) RGY 4330A (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at ti.com. (2) Product preview device. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. OPA330, OPA2330, OPA4330 UNIT Supply Voltage, VS = (V+) – (V–) +7 V Signal Input Terminals, Voltage(2) (V–) –0.3 to (V+) + 0.3 V Signal Input Terminals, Current(2) ±10 mA Output Short-Circuit(3) Continuous Operating Temperature –40 to +150 °C Storage Temperature –65 to +150 °C Junction Temperature +150 °C Human Body Model (HBM) 4000 V ESD Charged Device Model (CDM) 1000 V Ratings: Machine Model (MM) 400 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground, one amplifier per package. THERMAL INFORMATION OPA330AIYFF THERMAL METRIC(1) YFF UNITS 5 PINS qJA Junction-to-ambient thermal resistance 130 qJCtop Junction-to-case (top) thermal resistance 54 qJB Junction-to-board thermal resistance 51 °C/W yJT Junction-to-top characterization parameter 1 yJB Junction-to-board characterization parameter 50 qJCbot Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): OPA330 OPA2330 OPA4330 |
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