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NCP2811AMTTXG Datasheet(PDF) 5 Page - ON Semiconductor |
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NCP2811AMTTXG Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 14 page NCP2811 http://onsemi.com 5 Table 2. MAXIMUM RATINGS Rating Symbol Value Unit AVIN, PVIN Pins: Power Supply Voltage (Note 2) VP − 0.3 to + 6.0 V INL, INR Pins: Input (Note 2) A version B version VIN −VP – 0.3 to VP + 0.3 −2 to +2 V SD Pin: Input (Note 2) VYY −0.3 to VP + 0.3 V Human Body Model (HBM) ESD Rating are (Note 3) ESD HBM 2000 V Machine Model (MM) ESD Rating are (Note 3) ESD MM 200 V CSP 1.5 x 2.0 mm package (Notes 6 and 7) Thermal Resistance Junction to Case RqJC (Note 7) °C/W Operating Ambient Temperature Range TA −40 to + 85 °C Operating Junction Temperature Range TJ −40 to + 125 °C Maximum Junction Temperature (Note 6) TJMAX + 150 °C Storage Temperature Range TSTG −65 to + 150 °C Moisture Sensitivity (Note 5) MSL Level 1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Notes: 1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C. 2. According to JEDEC standard JESD22−A108B. 3. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins. Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins. 4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II. 5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. 6. The thermal shutdown set to 150°C (typical) avoids irreversible damage on the device due to power dissipation. 7. The RJA is highly dependent of the PCB Heatsink area. For example, RJA can equal 195°C/W with 50 mm2 total area and also 135°C/W with 50 mm2. The bumps have the same thermal resistance and all need to be connected to optimize the power dissipation. RqCA + 125 * TA PD * RqJC |
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